(May 15, 2017) We are pleased to announce Multi-Physics for IronCAD (MPIC) Product Update is now available for download for registered users. The update contains more than half a year of refinement and feature enhancement, and resolves all known reported issues.
(April 15, 2017) Three papers by AMPS development and support team have been accepted for presentation at International Conference on Computational Methods (ICCM 2017):
1) Large CAD assembly design analysis using Sefea (Strain-Enriched FEA) and MLS (Moving Least Squares) formulation
2) Simulation of Biological Tissues using Numerical Hyperelasticity and Strain Enriched Finite Element Analysis (Sefea)
3) Fatigue Life Prediction Based on AMPS Stress-Life Approach Fatigue FEA
(January 15, 2017) We are pleased to announce AMPS Designer product for general CAD users. The Designer series product line provides a streamline approach for easier CAD model import, FEA analysis controls, extensive material properties library, and intuitive boundary conditions for general to advanced design analysis applications.
(October 31, 2016) We are pleased to announce that after close to one year of development and testing, we have officially released AMPS 8.0. Customer with current licensing agreement can immediately download the update after logging in.
(October 6, 2016) AMPS Technologies Company filed Provisional Patent No 62404809 "XMD: eXtended Markup language Data tool for automatic data embedding, linking and processing in software applications." The patented technology is now embedded in all AMPS and OEM partner products.
(August 1, 2016) We are pleased to announce that AMPS 8.0 beta release is now available for download. The 8.0 products lines include a brand new XMD technology that enables all AMPS and partnership products to have a two-way exchangability so users can switch from different CAD/CAE tool to/from AMPS and among the different partner products, while keeping each individual proiduct's unique local features/functions. XMD technology encapulated the FEA model in object classes so application development can move on quickly without extensive API document and lengthy interface details. The technology also speeds up new generation Sefea technology development, eases technology adoption for partners, and brings further usabilities to customers in faster cycles.
(May 20, 2016) AMPS Technologies and IronCAD, LLC has jointly donated AMPS and IronCAD product to National Taiwan University and National Taiwan University of Science and Technology. These two leading universities plan to use the 3D CAD and Multiphysics CAE software for teaching and researches (press release)
(Jan 8, 2016) AMPS 7.0 is now available for download. This release contains many important new features and an updated interface. The updates include 2nd generation SefeaTM (Strain-Enriched FEA) formulation for solid, shell, coupled fluid-structure and electromagnetic applications. Other important features include moving-least-squares (MLSFEA) energy-based tying for large scale tying to overcome CAD part imperfection, enhanced interactive sidebar for streamline and cut-plane result contouring, new fluid inflow/outflow for severely shorten flow domain, and many more.
(Nov 9, 2015) We are extremely pleased to jointly announce Multi-Physics for IronCAD 2016 release with IronCAD, LLC. MPIC 2016 release now includes fluid on top of solid, electrical and thermal physics in an integrated product based on the SefeaTM LSFEA technology, and is one step further for CAD users and designers to perform instant what-if design analysis that used to take days or multiple tools to achieve. Evaluation version is immediately available at MPIC download
(November 13, 2014) We are extremely pleased to jointly announce Multi-Physics for IronCAD (MPIC) product with IronCAD, LLC . MPIC brings our proprietary SefeaTM (Strain-Enriched FEA) technology one step further to CAD users and designers and allows instant what-if design analysis that used to take analysts days to achieve. Evaluation version is immediately available at http://www.ironcad.com/MPIC.
(Feburary15, 2014) An updated SefeaTM Technology whitepaper is now available for download. The whitepaper covers the basic theory, applications, benchmarks, and the important milestone achievement of SefeaTM technology in the finite element applications, especially the significance for CAE applications.
(August 6, 2013) We are very pleased to announce that AMPS 6.7 preview version is now available. The latest release includes the cutting-edge Least-Squares Electromagnetic module that is fully coupled with stress, thermal, and fluid flow physics, suitable for complex analysis such as magneto-hydrodynamics analysis.
(March 21, 2012 AMPS Technologies Company is pleased to jointly announce the KeyCreator Analysis product with Kubotek USA.KeyCreator Analysis is now available as a completely integrated multiphysics simulation tool in the powerful KeyCreator direct CAD product. KeyAnalsyis employs the latest Sefea technology refinement for solid modeling and provides the best accuracy, robustness, and speed for general CAD users who demand simple, convenient yet powerful simulation tool.
(March 12, 2012) A new Sefea Technology whitepaper is now available for download. The whitepaper covers the basic theory, applications, benchmarks, and the important milestone achievement of Sefea technology in the finite element applications, especially the significance for CAE applications.
(August 16, 2011)We are pleased to announce AMPS 6.6 with Sefea is now available for download after nearly a year of rigorous beta testing. SefeaTM, Strain-Enriched Finite Element Analysis, is truly breakthrough FEM technology, utilizing automatic generated low-order tetrahedron elements to achieve results virtually equivalent to legacy methods employing large numbers of 2nd-order tetra or brick elements.
In our benchmark AMPS 6.6 with Sefea produced results virtually equivalent to the 2nd or higher order element results - yet with only 20% or fewer amount of the nodes. Because of the lower-order interpolation field, it does not produce oscillatory local results like 2nd-order family elements, and needing no hourglass mode controls such as the popular low-order brick elements. The simple low-order tetrahedral elements are also much more stable in dynamics, contact and impact simulations without the typical 2nd-order side-node vibrations noise. It is also insensitive to tetra/triangle mesh distortion and has a high convergence rate. Not only does this make design simulation easier to use with the robust automatic tetra mesher inside AMPS, they solve faster and are more realistic than ever before.
AMPS 6.6 also contains many new features: The latest multithread finite element engine now uses a proprietary "lock free" thread pool technology which pushes all cores in all CPUs to the system's limit. The refined mesh generation now will handle large assembly parts with automatic material boundary preservation, meshing consistency, and parts interference checking and repair. These enhanced features, along with Sefeatm technologies, help the AMPS users cut down the analysis time and efforts, and speed up product design cycles and trim the total product costs.
(July 9, 2010) We are pleased to announce the release of the Kubotek KeyCreator to AMPS translator add-in module. The add-in CDE module will easily export the existing KeyCreator models to AMPS, and KeyCreator users can immediately take advantage of AMPS advanced nonlinear and multi-physics analysis features. For details, please contact firstname.lastname@example.org.
(January 26, 2009) We are pleased to announce that AMPS 5.2 has been released on AMPS Tech web site and can be downloaded immediately for customer with an active maintenance agreement. Details of the enhancement and update can be found on the support page..
(June 2007) Professor Wang and his research team of the University of Pittsburgh MechanoBiology Laboratory will present an application using AMPS at the 9th USNCCM (US National Congress on Computational Mechanics). Details of the paper can be found in the registered user section "Micropost Force Sensor Array Modeling and Biological Applications"
(July 2006) Two papers based on AMPS technologies are presented at 7th WCCM (World Congresss on Computational Mechanics). Details of these papers can be download from the registed user section:
"A Converving Optimal Least-Squares Finite Element Method for CFD Problems"
"Studying the Load-Carrying Distribution of Pile-Raft Foundations by Nonlinear Finite Element Analysis"
(Jan 2006) AMPS Technologies was selected as one of the Emerging Technology Companies Pavilion, and participated in daratechSUMMIT2006. "We've searched the globe for new, exciting technologies and solutions from startups, emerging companies, and others and have selected the most promising of these and are bringing them to daratechSUMMIT2006!"
(April 2005) Two papers based on AMPS have been accepted for presentation at USNCCM8 (the Eighth U.S. National Congress on Computational Mechanics). The abstracts can be downloaded by clicking the links below.
"An OverSet Method for Fluid-Solid Interaction Analysis Based on Least-Squares Fluid Formulation"
"Micro-Lorentz-Force-Driven Linear Motor Simulation with Air Effect Using an OverSet Finite Element Method "